The Queen Machine is a high performance construct composed of several wafer scale processor arrays. A team of priests using consecrated CAD tools executes the design of each wafer. Each wafer contains a vast electrical circuit, which is etched onto multiple metal oxide layers using X-ray Lithography.

The ceremony for manufacturing the wafers, which make up our beloved Queen must be carried out perfectly. The procedure may be divided into twelve steps, called basic process steps. Upon completion, verification algorithms may be applied to test and validate the Queen’s functioning. If any errors occur throughout the procedure, and defects are allowed to appear on any of the wafers, the Queen must be discarded. The entire ceremony must then be repeated from the beginning.

1. Start with a single p-type crystal wafer of the purest quality.
2. Cover the wafer with a layer of of thick silicon oxide SiO2.
3. Cover wafer with a layer of photo-sensitive resist.
4. Place mask over the wafer with holes where you want to cut away the resist.
5. Expose the resist to a light source through the mask.
6. Develop the resist. This washes away the exposed resist.
7. Etch away the oxide where it is not protected by unexposed resist.
8. Bombard and dope the wafer with n-type impurities .
9. Heat wafer to allow dopant to diffuse into wafer where it is exposed.
10. Etch off undeveloped resist.
11. Mask out and cut holes to connect the metal layers.
12. Decide where to place connecting pin areas and on what layer to connect to the outside world.